MICROMACHINED THERMAL SHEAR-STRESS SENSOR
UCLA Technology Available For Licensing

A new type of miniaturized silicon hot-wire thermal shear-stress sensor has been developed that can be consistently mass produced as single units or in arrays for high spatial resolution 2-D flow field monitoring.

Due to the relatively effective thermal insulation of the hot-wire from its support structures, these sensors have an unprecedented shear-stress sensitivity of 15V/kPa under constant current drive (2mA, 12mW). They exhibit a typical bandwidth of 5 KHz.

Manufacturing costs would be less than $1/unit for a single sensor or for multiple sensor arrays.

Reference: UCLA Case No. 1995-515 US Patent Number: 5,883,310

For additional technical details and current licensing
availability, please contact the following UCLA office:

UCLA Office of Intellectual Property
11000 Kinross Avenue, Suite #200
Los Angeles, CA 90095-7231
Tel: 310-794-0558 Fax: 310-794-0638
email: ncd@research.ucla.edu
Lead Inventor: Chih-Ming Ho

UCLA Technologies Available for Licensing
http://www.research.ucla.edu/tech

Copyright © 2000 The Regents of the University of California.

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