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BACKGROUND: Model Order reduction techniques are helpful in the solution of complex systems of equations. Model order reduction techniques aim to reduce problem complexity while simultaneously maintaining suitable solution accuracy. While traditional techniques are appropriate for some applications, like solving for voltages and currents associated with electronic signal nets, these same techniques are not sufficient for other applications, like solving the behavior of on-chip and beyond-the-die power and ground grids, and solving the thermal behavior of 3D integration. The method described here is a new, novel order reduction technique that overcomes the limitations of existing solutions, making it suitable for a wider variety of problem applications including system-on-chip, system-in-package and 3D integration.
INNOVATION: The invention discloses model order reduction algorithms that can be implemented in software to allow for modeling and optimization of a wide variety of high-order, complex systems.
POTENTIAL APPLICATIONS
ADVANTAGES
DEVELOPMENT-TO-DATE: Prototype software has been developed and proven.
Reference: UCLA Case No. 2007-149
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