THERMALLY RE-MENDABLE CROSS-LINKED POLYMERS
UCLA Technology Available For Licensing

Researchers in the UCLA Department of Chemistry and Biochemistry have developed and reduced to practice a method of making thermally re-mendable polymers. Two separate parts of the material can be mended together upon heating to 120°C to 150°C, and better mending efficiencies can be obtained using higher temperatures. Some additional attractive characteristics of this polymer include:
  • Can endure multiple cycles of crack mending and structural function recovery;
  • Does not require additional ingredients such as a catalyst, additional monomer, or special surface treatment of the fractured surface;
  • Mechanical properties are in the range of commercial, state-of-the-art, cross-linked epoxy resins and unsaturated polyesters;
  • Hard, tough, and stable at ambient temperatures;
  • Suitable for long-term use;
  • Most of the solid polymers are transparent;
  • Easy to make;
  • Improved reliability and longer service life.
  • BACKGROUND:  Re-mendable polymers hold great promise in a variety of applications, such as automobiles, self-healing windows, and the protection of silicon chips. Several methods have been proposed to create self-healing materials. For example, thermoplastics are repaired by melting the material back together. Self-repairing molecules have embedded hollow fibers that can release repair chemicals when a crack propagates. This method has problems with its ability to self-heal multiple times. Cross-linked resins have reaction temperatures 150°C and higher.

    The present invention improves on each of the above methods.

    DEVELOPMENT TO DATE:  The invention has been fully implemented, taken from concept to design to practice. Mechanical properties of the material have been tested under a variety of conditions.

    Reference: UCLA Case No. 2002-343 US Patent No.: 6,933,361

    For additional technical details and current licensing
    availability, please contact the following UCLA office:

    UCLA Office of Intellectual Property
    11000 Kinross Avenue, Suite #200
    Los Angeles, CA 90095-7231
    Tel: 310-794-0558 Fax: 310-794-0638
    email: ncd@research.ucla.edu
    NCD URL:   http://www.research.ucla.edu/tech/ucla02-343.htm

    Lead Inventor: Fred Wudl

    UCLA Technologies Available for Licensing
    http://www.research.ucla.edu/tech

    Copyright © 2003 The Regents of the University of California.

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